Radiation Hardened Electronics Market: A Breakdown of the Industry by Technology, Application, and Geography

The report studies the factors influencing the growth of the industry in the global Radiation Hardened Electronics Market and offers accurate predictions about the growth pattern. The report pays special attention to the key elements of the Radiation Hardened Electronics Market, such as drivers, restraints, opportunities, threats, risks, limitations, and other aspects. The report covers a comprehensive analysis of the competitive landscape with a detailed analysis of the company profiles, product portfolio, and business expansion strategies.

The Global Radiation Hardened Electronics (RHE) market size was USD 1.48 billion in 2021 and is expected to register a revenue CAGR of 3.9% during the forecast period, according to the latest analysis by Emergen Research. Rising demand for low-cost nanosatellites and communication satellites and increasing intelligence, surveillance, and reconnaissance operations due to growing hostility among nations are factors driving market revenue growth between 2022 and 2030. Currently, increasing number of commercial space operations have led to growing demand for radiation-hardened power management systems. In addition, rapid integration of advanced technologies for electronics in spacecraft and rising usage of low-cost nanosatellites are expected to increase demand for radiation hardening electronics in space programs.

According to reports, around 64 countries have already launched their nanosatellites or CubeSats and by 2019 there were around 1,186 nanosatellites launched, which have increased in number in recent times. Moreover, increasing need for nanosatellite power conditioning procedures and usage of radiation-resistant materials are key factors expected to drive market growth. Furthermore, increasing implementation of microelectronics systems and post-irradiation examination for radiation hardening of electronics are other factors driving revenue growth of the market.

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Market Scope: The report explains the scope of various commercial possibilities in the global Radiation Hardened Electronics market over the upcoming years. The estimated revenue build-up over the forecast years has been included in the report. The report analyses the key market segments and sub-segments and provides deep insights into the market to assist readers with the formulation of lucrative strategies for business expansion.

Some Key Highlights from the Report

The rad-hard by software segment revenue is expected to expand at a substantially rapid CAGR during the forecast period. This is due to rising need for software upgrading and programmable devices for radiation protection of devices in high radiation exposures while nuclear weapon testing.
The aerospace & defense segment is expected to register a significantly robust revenue growth rate over the forecast period. This is due to increasing usage of small satellites with radiation-hardened electronics for defense purposes, which is expected to drive growth of the segment.
The North America market is expected to register a significantly rapid revenue growth rate over the forecast period due to increasing demand for spacecraft electronics and rising implementation of nuclear power plant testing regulations by governments.
Major companies in the market report include Micropac Industries Inc., BAE Systems Plc., Honeywell International Inc., ST Microelectronics N.V., Microchip Technology Inc., Solitron Devices Inc., Cobham Limited, pSemi Corporation, Infineon Technologies AG, and Renesas Electronics Corporation.

Market Taxonomy:

Chapter 1: Methodology & Scope

Definition and forecast parameters
Methodology and forecast parameters
Data Sources
Chapter 2:

Executive Summary

Business trends
Regional trends
Product trends
End-use trends
Chapter 3:

Industry Insights

Industry segmentation
Industry landscape
Vendor matrix
Technological and innovation landscape
Chapter 4:

Company Profile

Business Overview
Financial Data
Product Landscape
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Emergen Research has segmented the global radiation hardened electronics market based on manufacturing technique, product type, component type, application, and region:

· Manufacturing Technique Outlook (Revenue, USD Billion; 2019-2030)

Rad-hard By Process
Rad-hard By Design
Rad-hard By Software
· Product Type Outlook (Revenue, USD Billion; 2019-2030)

Commercial-off-the-shelf (COTS)
Custom Made
· Component Type Outlook (Revenue, USD Billion; 2019-2030)

Controllers & Processors
Analog & Digital Mixed Signal Devices
Memory
Power management
· Application Outlook (Revenue, USD Billion; 2019-2030)

Aerospace & Defense
Nuclear Power Plant
Space
Others
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Geographical Segmentation:

The latest research report entails an in-depth analysis of the current growth opportunities for various regions of the Radiation Hardened Electronics Market, gauging their revenue share over the forecast timeline. Furthermore, the report analyses the year-on-year growth rate of these regions over the forecast duration. The leading market regions profiled in the report are North America, Europe, Asia Pacific, Latin America, and Middle East & Africa.

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